picosecond laser marking

brief description

  • Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
  • LCD, OLED screen cutting (C, R, U angle cutting).
  • Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.

Categories Picosecond laser marking machine

SPECIFICATION

EP-IRPS-20

Laser power
20W / 10ps / 1000kHz
Wavelength
1064nm
Laser repetition frequency
1000KHz
Marking scope
100mm×100mm
Min. character
0.06mm
Marking line width
≤0.03mm
Marking depth
≤0.1mm
Repetition accuracy
±0.001mm
Power supply
AC 220V, 50Hz, 16A
Total power consumption
≤1.5kW

FEATURES

  • Good beam quality, small spot size for ultra-fine marking.
  • The heat affected zone is small, avoiding damage to the processed material and high yield.
  • Marking speed, high efficiency, high precision.
  • No consumables, low cost of use and maintenance.
  • The machine performance is stable, long-term operation.
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